Nano machining

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(日本語) 超精密非球面加工(無電解NiP)

(日本語) 超精密非球面加工(無電解NiP)

Material
(日本語) STAVAX + 無電解NiP
Dimensions
(日本語) Φ5mm x サグ0.625mm凹 (非球面部)
Accuracy
(日本語) 形状精度 PV0.043μm(ベストフィットPV0.034μm) Ra3nm
(日本語) 仕上げ加工機:東芝機械 ULG-100D
単結晶ダイヤモンドバイトによる超精密加工です。
磨きレスで数ナノオーダーの面粗度を実現しています。

Small aspherical mold

Small aspherical mold

Material
Cemented carbide
Dimensions
Processing Φ 1.5mm (Aspherical <Φ 1mm)
Accuracy
PV<0.1μm
 

Aspherical lens mold core

Aspherical lens mold core

Material
(HPM38 or STAVAX or Al) + Ni-P, SiC, Tungsten carbide
Dimensions
Φ 1 - Φ 150mm (reference)
Equipment: High-precision aspherical surface processor and free-form surface grinder

Process: Aspheric surface processing with accuracy guarantee P-V 0.15µm

Sample parts

Sample parts

Material
A5052
Dimensions
10T x 50 x 50
Equipment; Machining center

Process: Inner surface cut to mirrored surface with roughness Ra0.05

Mold die for the microlens array

Mold die for the microlens array

Material
STAVAX+Ni -P
Dimensions
20 x 20mm (Array area)
Shape error: PV <= 0.5μm 、Optical axis position error: <= +-1μm (each cell)
Cells interval: 330μm
(This is an example.)

Glass lens mould

Glass lens mould

Material
HPM38 + Electroless nickel
Dimensions
Ф51.64 x 60
Process: Sphere dimensional accuracy Ф51.64 ± 0.002

Surface roughness Ra0.0052

Mirrored surface grinding

Mirrored surface grinding

Material
SUS440
Dimensions
15T x 50 x 100
Equipment: Milling machine, surface grinder

Process: Surface ground to mirrored surface
Planarity 0.005, surface roughness Ra0.05

Glass lens mould

Glass lens mould

Material
Silicon carbide
Dimensions
10T x 50 x 50
Equipment: Machining center, surface grinder

Process: Surface ground to mirrored surface
Planarity within 0.003, surface roughness Ra0.05

Machine tool manufacturing

Machine tool manufacturing

Material
S45C and tungsten carbide
Dimensions
Ф80 x 80
Equipment: Lathe, milling machine, inside and outside diameter grinder, surface quencher (outsourced)

Process: Outside diameter ground, inside diameter brazed with tungsten carbide, inside tapered diameter ground to mirrored surface with surface roughness Ra0.05

Sample parts

(日本語) SiCセラミックス 外径嵌合研削部品

Material
Silicon carbide
Dimensions
Ф40 x 150
Equipment: Numeric control lathe, outside surface grinder

Process: Taper outer diameter ground to mirrored surface
MT4 tapered-element surface roughness of Ra.0.05, surface polish presented without hand-polish
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075-953-2721
FAX
075-951-2267

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